Enron Mail

From:alerts@alerts.equityalert.com
To:alewis@ect.enron.com
Subject:Your News Alert for BRCM
Cc:
Bcc:
Date:Mon, 4 Jun 2001 09:37:01 -0700 (PDT)


[IMAGE]=09[IMAGE]=09[IMAGE]=09


Market Watch [IMAGE] Largest Short Postition Decreases [IMAGE] La=
rgest Short Postition Increases [IMAGE] Lock-up Expiry Dates [IMAGE] =
IPO Quiet Periods Expiries [IMAGE] IPO Withdrawals [IMAGE] Analyst =
EPS Change - Upside [IMAGE] Analyst EPS Change - Downside [IMAGE] Hig=
hest Analyst Activity [IMAGE] Earnings Calendar - This Week [IMAGE]=
Upcoming Splits [IMAGE] Stock Splits [IMAGE] Coverage Initiation =
[IMAGE] Coverage Re-Iteration HelpDesk [IMAGE] Unsubscribe [IMA=
GE] Update my Membership / Profile [IMAGE] Forgot Username / Password =
[IMAGE]Add / Edit Alerts [IMAGE]View My Alerts [IMAGE] =
=09 As requested, your News Alert for BRCM follows from EquityAlert.com. =
Broadcom Introduces High-Performance Single-Chip All-CMOS Bluetooth Radi=
o MONTE CARLO, Monaco, Jun 4, 2001 (BUSINESS WIRE) -- Bluetooth Congress =
2001 Blutonium(TM) Chip Combines Radio and Baseband Functions on =
Monolithic High-Performance Single-Chip Transceiver Broadcom Corporation=
(Nasdaq:BRCM), the leading provider of integrated circuits enabling broadb=
and communications, today introduced the Broadcom(R) BCM2033 single-chip tr=
ansceiver for Bluetooth(TM) wireless applications. Integrating previously d=
eveloped, Bluetooth-compliant radio and baseband components onto a single h=
igh-performance integrated circuit, the chip minimizes component counts and=
board space requirements while providing a high-performance solution to th=
e Bluetooth short-range wireless connectivity challenges faced by equipment=
manufacturers. The Blutonium(TM) BCM2033 achieves the highest performanc=
e of any single-chip Bluetooth transceiver in the industry, combining Bluet=
ooth-qualified radio and baseband circuits onto a single monolithic chip. O=
n-board Fractional-N synthesizer technology allows the chip to work with pr=
actically any reference frequency available. This is especially useful in c=
urrent and third generation (3G) cellular phones in which a wide variety of=
crystal oscillators are available. Featuring high levels of integration an=
d minimal off-chip filters or other active components, the BCM2033 provides=
excellent performance in the presence of radio interferers and is ideally =
suited for harsh radio frequency (RF) environments, such as inside mobile p=
hones and laptop computers. In addition, the chip's unique design allows it=
to maintain its high performance even across the extended temperature rang=
e of between -40 and +105 degrees centigrade, an accomplishment unparallele=
d in the industry. "With our previously announced Blutonium products, we =
demonstrated our unique ability to achieve outstanding radio performance de=
signing chips in a standard digital CMOS process," said K.C. Murphy, Vice P=
resident and General Manager of Broadcom's RF and Advanced Mixed Signal Bus=
iness Unit. "We've now applied Broadcom's well-known integration expertise =
by combining RF and digital circuits onto a single substrate while maintain=
ing unmatched performance among Bluetooth transceivers. As a result, we're =
unveiling the single-chip Bluetooth transceiver the industry has been waiti=
ng for, with performance exceeding that of practically any other solution, =
regardless of the process technology." The BCM2033 is based upon Broadcom=
's previous all-CMOS stand-alone radios and basebands that have already ach=
ieved Bluetooth Version 1.1 qualification and which exceed the Bluetooth sp=
ecification in most areas. This means that devices such as mobile phones an=
d PC cards built using Blutonium components are compatible with the latest =
version of the Bluetooth specification, easing the process by which these d=
evices can apply the Bluetooth logo to their products. The BCM2033 benefits=
from this previous development, achieving strong performance in key areas =
such as linearity and receiver sensitivity, attaining a sensitivity figure =
of better than -82 dBm. Integration of the previously developed circuits =
onto a single chip was made possible because the entire Blutonium line, lik=
e all Broadcom chip products, was developed in a standard digital CMOS (or =
Complimentary Metal Oxide Semiconductor) manufacturing process. No other pr=
ocess allows the combination of RF and digital circuits on a single transce=
iver. "By first proving our radio and baseband architectures in CMOS with=
standalone products, we've chosen to emphasize performance in our Bluetoot=
h component development program," said Scott Bibaud, Director of Marketing =
for Broadcom's Bluetooth Products. "With these multiple Blutonium elements =
integrated onto a single cost-effective chip, we can now leverage Broadcom'=
s proven reputation for operational excellence and provide these components=
in production quantities to our customers around the world." Key Feature=
s The BCM2033 has been designed to provide very high performance in Blueto=
oth applications with a single transceiver. Notable features include: -- =
Strong spurious emissions performance -- the BCM2033 minimizes interfe=
rence from transmissions taking place in the bands used by mobile phone=
s, providing robust connections between Bluetooth devices. -- Excepti=
onal blocking performance -- the highly linear design eliminates the ne=
ed for costly off-chip RF filtering to receive reliable signals from ot=
her Bluetooth devices. -- Fractional-N Synthesizer -- this synthesizer en=
ables the 2033 to use any existing frequency reference, including those=
commonly available in mobile phones such as CDMA, WCDMA, GSM, GPRS, an=
d UMTS, eliminating the need for an off-chip crystal. -- Extensive so=
ftware support -- the BCM2033 is software-compatible with protocol stac=
ks developed by leading third party stack vendors, as well as with Broa=
dcom's internal stack. -- Cost-effective memory architecture -- on-chip m=
emory eliminates the need for off-chip flash while allowing the use of =
additional memory when appropriate. -- Requires minimal off-chip comp=
onents -- by eliminating all external active components, the BCM2033 re=
quires just a few passive components, providing very limited bill of ma=
terials (BOM) and board space impact on OEM equipment designs. Avai=
lability The version of the BCM2033 with no external memory bus is package=
d in a 64-pin fine pitch Ball Grid Array (fpBGA) and the version with exter=
nal flash interfaces is packaged in a 100-pin fpBGA. The transceiver is sam=
pling now to early access customers. About Broadcom Broadcom Corporation=
is the leading provider of highly integrated silicon solutions that enable=
broadband communications and networking of voice, video and data services.=
Using proprietary technologies and advanced design methodologies, Broadcom=
designs, develops and supplies complete system-on-a-chip solutions and rel=
ated applications for digital cable set-top boxes and cable modems, high-sp=
eed local, metropolitan and wide area and optical networks, home networking=
, Voice over Internet Protocol (VoIP), carrier access, residential broadban=
d gateways, direct broadcast satellite and terrestrial digital broadcast, d=
igital subscriber lines (xDSL), wireless communications, System I/O(TM) ser=
ver solutions and network processing. Broadcom is headquartered in Irvine, =
Calif., and may be contacted at 949/450-8700 or at www.broadcom.com. Safe=
Harbor Statement under the Private Securities Litigation Reform Act of 199=
5: This release may contain forward-looking statements that are based on =
our current expectations, estimates and projections about our industry, and=
reflect management's beliefs and certain assumptions made by us based upon=
information available to us at this time. Words such as "anticipates," "ex=
pects," "intends," "plans," "believes," "seeks," "estimates," "may," "will"=
and variations of these words or similar expressions are intended to ident=
ify forward-looking statements. In addition, any statements that refer to e=
xpectations, projections or other characterizations of future events or cir=
cumstances, including any underlying assumptions, are forward-looking state=
ments. These statements speak only as of the date hereof. Such information =
is subject to change, and we will not necessarily inform you of such change=
s. These statements are not guarantees of future performance and are subjec=
t to risks, uncertainties and assumptions that are difficult to predict. Th=
erefore, our actual results could differ materially and adversely from thos=
e expressed in any forward-looking statements as a result of various factor=
s. Important factors that may cause such a difference for Broadcom in con=
nection with the Blutonium BCM2033 product includes, but are not limited to=
, general economic conditions and specific conditions in the markets we add=
ress, including the recent significant economic slowdown in the technology =
sector and semiconductor industry; the timing and successful completion of =
technology and product development through volume production; the rate at w=
hich our present and future customers and end-users adopt Broadcom's techno=
logies and products in the markets for Bluetooth wireless applications; del=
ays in the adoption and acceptance of industry standards in those markets; =
the timing of customer-industry qualification and certification of our prod=
ucts and the risks of non-qualification or non-certification; the timing, r=
escheduling or cancellation of significant customer orders; the loss of a k=
ey customer; the volume of our product sales and pricing concessions on vol=
ume sales; the qualification, availability and pricing of competing product=
s and technologies and the resulting effects on sales and pricing of our pr=
oducts; the effectiveness of our expense and product cost control and reduc=
tion efforts; intellectual property disputes and customer indemnification c=
laims and other types of litigation risk; the availability and pricing of f=
oundry and assembly capacity and raw materials; fluctuations in the manufac=
turing yields of our third party semiconductor foundries and other problems=
or delays in the fabrication, assembly, testing or delivery of our product=
s; our ability to specify, develop or acquire, complete, introduce, market =
and transition to volume production new products and technologies in a time=
ly manner; the effects of new and emerging technologies; the risks of produ=
cing products with new suppliers and at new fabrication and assembly facili=
ties; problems or delays that we may face in shifting our products to small=
er geometry process technologies and in achieving higher levels of design i=
ntegration; the risks and uncertainties associated with our international o=
perations; our ability to retain and hire key executives, technical personn=
el and other employees in the numbers, with the capabilities, and at the co=
mpensation levels needed to implement our business and product plans; chang=
es in our product or customer mix; the quality of our products and any reme=
diation costs; the effects of natural disasters and other events beyond our=
control; the level of orders received that can be shipped in a fiscal quar=
ter; and other factors. Our Annual Report on Form 10-K, recent Quarterly =
Report on Form 10-Q, recent Current Reports on Forms 8-K and 8-K/A, and oth=
er Securities and Exchange Commission filings discuss some of the important=
risk factors that may affect our business, results of operations and finan=
cial condition. We undertake no obligation to revise or update publicly any=
forward-looking statements for any reason. Note to Editors: Broadcom(R),=
the pulse logo(R), System I/O(TM), and Blutonium(TM) are trademarks of Bro=
adcom Corporation and/or its affiliates in the United States and certain ot=
her countries. Bluetooth(TM) is a trademark owned by Telefonaktiebolaget LM=
Ericsson AB and licensed to participants in the Bluetooth Special Interest=
Group (SIG) in the United States and certain other countries. All other tr=
ademarks mentioned are the property of their respective owners. CONTACT: =
Broadcom Corporation Henry Rael (public relation=
s), 310/938-1596 hrael@broadcom.com or =
Nick Kormeluk (investor relations), 949/585-6932 =
nickk@broadcom.com or Scott B=
ibaud (technical and marketing), 310/524-0065 sbibaud@bro=
adcom.com URL: http://www.businesswire.com Today's News On The=
Net - Business Wire's full file on the Internet with Hyperlinks to your ho=
me page. Copyright (C) 2001 Business Wire. All rights reserved. -0- KE=
YWORD: CALIFORNIA INTERNATIONAL EUROPE INDUSTRY KEYWORD: HARDWARE =
NETWORKING TELECOMMUNICATIONS =
PRODUCT [IMAGE] ***IMPORTANT NOTICE AND DISCLAIMER REGARDIN=
G THIS COURTESY EMAIL*** At your request, as a subscriber to our service,=
this email alert is being sent to you as a courtesy and is for information=
purposes only. We are a financial news re-distributor. We are not an i=
nvestment advisory and do not purport to tell or suggest which companies y=
ou should monitor or which securities you should purchase or sell. In add=
ition to the information regarding the company you are monitoring (the "Mo=
nitored Company"), this email contains an advertisement describing a produ=
ct, service or company for which we received a fee, at our normal advertisi=
ng rates of $55 per 1,000 e-mails (subject to volume and other discounts), =
from the advertising company. In the case of Micron Enviro Systems, Inc. =
we received a fee of three hundred and sixty thousand free trading shares =
of Micron Enviro Systems, Inc. from Clarion Investments, Inc. We reserve th=
e right to sell all or part of these shares at anytime, either before, dur=
ing or after the advertisement period. In addition, not withstanding ou=
r policy of prohibiting employees from buying or selling securities of an a=
dvertising company for a period of 20 days following dissemination of the a=
dvertisement, we may not be able to effectively monitor our employees to en=
sure compliance with the same. Consequently, there may be sales and/or pur=
chases of such securities by our employees prior to, during and immediately=
following the dissemination of the advertisement. Please note that (1) t=
his email may not contain the full text of the press release issued by, or=
the research or other reports regarding, the Monitored Company; and (2) t=
he text of the advertisement, the press release and/or reports were obtain=
ed from third party sources and were not written, generated or edited by =
us; accordingly, we make no representations or give any assurance as to th=
e accuracy or completeness, nor have we conducted any independent investiga=
tions of, the disclosures regarding the subject matter of such releases an=
d reports. Please note that links to the advertising company and/or Moni=
tored Company are provided for your convenience. We assume no obligation =
for the content of such sites. All information contained herein should be=
independently verified by you with the advertising company or with Monito=
red Company or any other sources you prefer. [THIS IS ONLY A SUMMARY OF, =
AND IS QUALIFIED IN ITS ENTIRETY BYREFERENCE TO, THE "EQUITYALERT SUBSCRIB=
ER AGREEMENT ANDDISCLAIMER." PLEASE VISIT http://www.equityalert.com/home=
/disclaim.asp FOR ACCESS TO OUR COMPLETE DISCLAIMER] =09 [IMAGE] =
[IMAGE] =09